Meigen Shen : rechercher sur Z-Library

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1

UWB radio module design for wireless sensor networks

Majid Baghaei Nejad, Meigen Shen, Tero Koivisto, Teemu Peltonen, Esa Tjukanoff, Hannu Tenhunen, Li-Rong Zheng

Journal:

Analog Integrated Circuits and Signal Processing

Année:

2007

Langue:

english

Fichier:

PDF, 2.10 MB

english, 2007

2

[IEEE 2020 IEEE International Conference on Power, Intelligent Computing and Systems (ICPICS) - Shenyang, China (2020.7.28-2020.7.30)] 2020 IEEE International Conference on Power, Intelligent Computing and Systems (ICPICS) - Coupling Characteristics of Noise Radiation and Tank Wall Vibrations of Typical Distribution Transformers Based on Field Measurements

Yunxiang, Zhu, Feng, Tu, Zhiyong, Wang, Jingyu, Hu, Chong, Shen, Jianfeng, Xu, Hequn, Min, Meigen, Cao

Année:

2020

Fichier:

PDF, 4.03 MB

2020

3

[IEEE 2005 IEEE International Symposium on Circuits and Systems - Kobe, Japan (23-26 May 2005)] 2005 IEEE International Symposium on Circuits and Systems - Case Study of Interconnect Analysis for Standing Wave Oscillator Design

Meigen Shen,, Li-Rong Zheng,, Tenhunen, H., Tjukanoff, E., Isoaho, J.

Année:

2005

Langue:

english

Fichier:

PDF, 204 KB

english, 2005

4

[IEEE Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design and Packaging and Components Failure Analysis - 2005 - Shanghai (2005.06.27-2005.06.29)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - A 0.18 μm CMOS Ultra-Wideband Low-Noise Amplifier with High IIP3

Teemu Peltonen,, Meigen Shen,, Tero Koivisto,, Xinzhong Duo,, Esa Tjukanoff,, Li-Rong Zheng,, Hannu Tenhunen,

Année:

2005

Langue:

english

Fichier:

PDF, 111 KB

english, 2005

5

Wireless sensor network for real-time perishable food supply chain management

Wang, Junyu, Wang, He, He, Jie, Li, Lulu, Shen, Meigen, Tan, Xi, Min, Hao, Zheng, Lirong

Journal:

Computers and Electronics in Agriculture

Année:

2015

Langue:

english

Fichier:

PDF, 3.58 MB

english, 2015

6

Robustness enhancement through chip-package co-design for high-speed electronics

Meigen Shen, Jian Liu, Li-Rong Zheng, Esa Tjukanoff, Hannu Tenhunen

Journal:

Microelectronics Journal

Année:

2005

Langue:

english

Fichier:

PDF, 530 KB

english, 2005

7

Wireless Sensing System-on-Chip for Near-Field Monitoring of Analog and Switch Quantities

Dong Li, Meigen Shen, Jiangtao Huangfu, Jiang Long, Yong Tao, Jingyu Wang, Changzhi Li, Lixin Ran

Journal:

IEEE Transactions on Industrial Electronics

Année:

2012

Langue:

english

Fichier:

PDF, 1.46 MB

english, 2012

8

[IEEE 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - Shanghai, China (2005.6.27-2005.6.27)] 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis - UWB Radio Module Design for Wireless Intelligent Systems-From Specification to Implementation

Shen, Meigen, Koivisto, Tero, Peltonen, Teemu, Zheng, Li-rong, Tjukanoff, Esa, Tenhunen, Hannu

Année:

2006

Langue:

english

Fichier:

PDF, 253 KB

english, 2006

9

[IEEE International Symposium on Signals, Circuits and Systems, 2005. ISSCS 2005. - Iasi, Romania (July 14-15, 2005)] International Symposium on Signals, Circuits and Systems, 2005. ISSCS 2005. - UWB transceiver circuits design for WPANs applications

Meigen Shen,, Koivisto, T., Peltonen, T., Li-Rong Zhang,, Tjukanoff, E., Tenhunen, H.

Année:

2005

Langue:

english

Fichier:

PDF, 716 KB

english, 2005

10

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Cost-performance driven mixed-signal system partitioning: a case study on SDH/SONET OAN interface

Meigen Shen,, Li-Rong Zheng,, Tenhunen, H.

Année:

2004

Langue:

english

Fichier:

PDF, 515 KB

english, 2004

11

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Chip-package co-design for high performance and reliability off-chip communications

Meigen Shen,, Jian Liu,, Li-Rong Zheng,, Hannu Tenhunen,

Année:

2004

Langue:

english

Fichier:

PDF, 606 KB

english, 2004

12

[IEEE Sixth International Symposium on Quality of Electronic Design (ISQED'05) - San Jose, CA, USA (21-23 March 2005)] Sixth International Symposium on Quality of Electronic Design (ISQED'05) - Concurrent Chip Package Design for Global Clock Distribution Network Using Standing Wave Approach

Meigen Shen,, Li-Rong Zheng,, Tjukanoff, E., Isoaho, J., Tenhunen, H.

Année:

2005

Langue:

english

Fichier:

PDF, 210 KB

english, 2005

13

[IEEE ISCAS 2003. International Symposium on Circuits and Systems - Bangkok, Thailand (25-28 May 2003)] Proceedings of the 2003 International Symposium on Circuits and Systems, 2003. ISCAS '03. - Case study of cost and performance trade-off analysis for mixed-signal integration in system-on-chip

Meigen Shen,, Li-Rong Zheng,, Tenhunen, H.

Année:

2003

Langue:

english

Fichier:

PDF, 283 KB

english, 2003

14

[IEEE 2005 55th Electronic Components and Technology Conference - Lake Buena Vista, FL, USA (31 May-3 June 2005)] Proceedings Electronic Components and Technology, 2005. ECTC '05. - Embedded smart systems for intelligent paper and packaging

Li-Rong Zheng,, Meigen Shen,, Xingzhong Duo,, Tenhunen, H.

Année:

2005

Langue:

english

Fichier:

PDF, 955 KB

english, 2005

15

[IEEE Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Shanghai, China (30 June-3 July 2004)] Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '04) - Design and implementation of system-on-package for radio and mixed-signal applications

Li-Rong Zheng,, Xingzhong Duo,, Meigen Shen,, Torrika, T., Michielsen, W., Tenhunen, H., Liu Chen,, Gang Zou,, Johan Liu,

Année:

2004

Langue:

english

Fichier:

PDF, 972 KB

english, 2004

16

[ACM Press the 2003 international workshop - Monterey, CA, USA (2003.04.05-2003.04.06)] Proceedings of the 2003 international workshop on System-level interconnect prediction - SLIP '03 - System level interconnect design for network-on-chip using interconnect IPs

Liu, Jian, Shen, Meigen, Zheng, Li-Rong, Tenhunen, Hannu

Année:

2003

Langue:

english

Fichier:

PDF, 266 KB

english, 2003

17

[IEEE Proceedings of the IEEE 6th Circuits and Systems Symposium on Emerging Technologies: Frontiers of Mobile and Wireless Communication (IEEE Cat. No.04EX710) - Shanghai, China (May 31-June 2, 2004)] Proceedings of the IEEE 6th Circuits and Systems Symposium on Emerging Technologies: Frontiers of Mobile and Wireless Communication (IEEE Cat. No.04EX710) - Performance and cost estimations of packaged single band voltage controlled oscillators

Michielsen, W., Meigen Shen,, Zheng, L.R., Tenhunen, B.

Année:

2004

Langue:

english

Fichier:

PDF, 242 KB

english, 2004

18

Evaluating the Role of the EOF Analysis in 4DEnVar Methods

Kou, Xingxia, Huang, Zhekun, Liu, Hongnian, Zhang, Meigen, Shen, Si, Peng, Zhen

Journal:

Année:

2017

Langue:

english

Fichier:

PDF, 2.97 MB

english, 2017